Use your thermal design experience with power semiconductors in TO-220 and TO-126 style power packages to help you get the most out of this unique family of power resistors. The thermal design issues are the same where power handling capability is based on the case temperature which is maintained in your design. MP820 and MP821 TO-220 Style Power Package with Metal Mounting Tab • 20 Watts at +25°C Case Temperature derated to zero at +175°C. • MP820 Resistance Range of 10.0 ohm to 10.0 K. • MP821 Resistance Range of 0.020 ohm to 9.99 ohm. • Resistor element is electrically isolated from the mounting surface. • Non-Inductive design for high speed switching, snubbers, and rf applications. Construction of MP820 and MP821: The MP820 and MP821 Kool-Tab® Power Film Resistors are constructed with Caddock's Micronox® resistance film fired onto a flat ceramic substrate which is thermally bonded to the copper heat sink tab. The resistor body is then molded with a high temperature molding compound to finish the metal tab TO-220 package. The lead wire attachment and resistance element geometry are configured to provide outstanding non-inductive performance. MP825 and MP850 Power Film Resistors Include an Integral Metal Mounting Surface for Highly Efficient Thermal Transfer MP825 TO-126 Style Power Package_ • 25 Watts at +25°C Case Temperature derated to zero at +150°C. • Copper Heat Sink Integral in the Molded Package. • Resistance Range of 0.020 ohm to 10.0 K. • Resistor element is electrically isolated from the mounting surface. • Non-inductive Design. MP850 TO-220 Style Power Package_ • 50 Watts at +25°C Case Temperature derated to zero at +150°C. • Copper Heat Sink Integral in the Molded Package. • Resistance Range of 0.20 ohm to 10.0 K. • Resistor element is electrically isolated from the mounting surface. • Non-inductive Design. Construction of MP825 and MP850: The MP825 and MP850 Kool-Pak® Power Film Resistors are constructed with Caddock's Micronox® resistance film fired onto a flat ceramic substrate. The ceramic substrate is bonded to a copper heat sink which becomes the metal mounting surface. This assembly is molded with the copper heat sink flush with the back surface of the part. The terminal attachment and resistance element geometry are configured to provide outstanding non-inductive performance. |